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z - power led x10490 z - power led x10490 technical data sheet 1 ?? rev: 00 www.seoulviosys.com www.seoulviosys.com specification CUN8AF1A svc customer drawn approval approval rohs
z - power led x10490 z - power led x10490 technical data sheet 2 ?? rev: 00 www.seoulviosys.com www.seoulviosys.com [ contents ] 1. description 2. outline dimensions 3. characteristics of CUN8AF1A 4. characteristic diagrams 5. binning & labeling 6. reel packing 7. recommended solder pad 8. reflow soldering profile 9. reliability 10. precaution for use 11. revision history
z - power led x10490 technical data sheet 3 ?? rev: 00 www.seoulviosys.com www.seoulviosys.com features applications description high power uv led series are designed for high current operation and high power output applications. it incorporates state of the art smd design and low thermal resistant material. aap63 led is ideal uv light source for curing, printing, and detecting applications. ? super high power output ? designed for high current operation ? low thermal resistance ? smt solderable ? lead free product ? rohs compliant ? uv curing ? printing ? coating ? adhesive ? counterfeit detection/ security ? uv torch ? fluorescence photography ? dental curing ? crime inspection ? oil leak detection CUN8AF1A CUN8AF1A
z - power led x10490 z - power led x10490 technical data sheet 4 ?? rev: 00 www.seoulviosys.com www.seoulviosys.com outline dimensions < circuit diagram> 2 1 anode cathode (tolerance : 0.2, unit : L ) < package outline> cathode mark top bottom side electrical isolation ? ? ? ? ? ? . . . . . . cathode anode notes : [1] all dimensions are in millimeters. [2] scale : none [3] undefined tolerance is 0.2mm material i nformation pkg body metal lens glass
z - power led x10490 z - power led x10490 technical data sheet 5 ?? rev: 00 www.seoulviosys.com www.seoulviosys.com characteristics of CUN8AF1A 1 - 1 electro - optical characteristics at 500ma 1 - 2 absolute maximum ratings notes : 1. peak wavelength measurement tolerance : 3nm 2. radiant flux measurement tolerance : 10% 3. e is the total radiant flux as measured with an integrated sphere. 4. forward voltage measurement tolerance : 3% 5. r j - b is the thermal resistance between chip junction to pcb board bottom. the pcb is made of aluminium and the size of pcb is 3.5mm by 3.5mm (t a =25 , rh=30%) parameter symbol value unit peak wavelength [1] p 385 nm radiant flux [2] e [3] 950 mw forward voltage [4] v f 3.8 v spectrum half width 12 nm view angle 2 1/2 110 deg. thermal resistance r j - b [5] 5.9 oc /w parameter symbol value unit forward current i f 700 ma junction temperature t j 125 oc operating temperature t opr - 10 ~ +85 oc storage temperature t stg - 40 ~ +100 oc
z - power led x10490 z - power led x10490 technical data sheet 6 ?? rev: 00 www.seoulviosys.com www.seoulviosys.com 0.0 0.2 0.4 0.6 0.8 1.0 1.2 250 300 350 400 450 500 relative spectrum power distributrion wavelength [nm] 0 100 200 300 400 500 600 700 0 1 2 3 4 5 forward current [ma] forward volatage [v] 1. relative spectral power distribution (i f =500ma, t a =25 , rh=30%) characteristic diagrams 2. forward current vs forward voltage (t a =25 )
z - power led x10490 z - power led x10490 technical data sheet 7 ?? rev: 00 www.seoulviosys.com www.seoulviosys.com 0 20 40 60 80 100 120 140 160 0 100 200 300 400 500 600 700 relative radiant flux [%] forward current [ma] 350 360 370 380 390 400 410 0 100 200 300 400 500 600 700 peak wavelength [nm] forward current [ma] 3. relative radiant flux vs forward current 4. peak wavelength vs forward current (t a =25 ) (t a =25 )
z - power led x10490 z - power led x10490 technical data sheet 8 ?? rev: 00 www.seoulviosys.com www.seoulviosys.com 350 360 370 380 390 400 410 25 35 45 55 65 75 85 peak wavelength [nm] ambient temperature [ ] 5. relative radiant flux vs ambient temperature 6. peak wavelength vs ambient temperature (i f =500ma) (i f =500ma) 0 20 40 60 80 100 120 25 35 45 55 65 75 85 relative radiant flux [%] ambient temperature [ ]
z - power led x10490 z - power led x10490 technical data sheet 9 ?? rev: 00 www.seoulviosys.com www.seoulviosys.com 3.2 3.4 3.6 3.8 4.0 4.2 4.4 25 35 45 55 65 75 85 forward voltage [v] ambient temperature [ ] 7. forward voltage vs ambient temperature (i f =500ma) 8. radiation pattern 0 0.5 1 - 90 - 45 0 45 90 relative radiant flux viewing angle [ deg.] (i f =500ma)
z - power led x10490 z - power led x10490 technical data sheet 10 ?? rev: 00 www.seoulviosys.com www.seoulviosys.com 0 200 400 600 800 1000 0 10 20 30 40 50 60 70 80 90 100 maxium current [ma] ambient temperature [ ] 9. allowable forward current vs ambient temperature (t j max = 125 i f =700ma) rja = 20 /w rja = 25 /w rja = 30 /w
z - power led x10490 z - power led x10490 technical data sheet 11 ?? rev: 00 www.seoulviosys.com www.seoulviosys.com 1. binning structure binning & labeling part number y 1 y 2 y 3 y 4 wp [nm] radiant flux [mw] vf [v] bin min max bin min max bin min max CUN8AF1A m 380 390 j3 690 760 a 3.0 3.4 j4 760 840 b 3.4 3.8 j5 840 920 c 3.8 4.2 k1 920 1000 d 4.2 4.6 k2 1000 1100 notes : 1. peak wavelength measurement tolerance : 3nm 2. radiant flux measurement tolerance : 10% 3. forward voltage measurement tolerance : 3% (i f =500ma) y 1 y 2 y 3 y 4 2. rank - y 1 : peak wavelength [nm] - y 2 y 3 : radiant flux [mw] - y 4 : forward voltage [v] y 1 y 2 y 3 y 4
z - power led x10490 z - power led x10490 technical data sheet 12 ?? rev: 00 www.seoulviosys.com www.seoulviosys.com 3. label x 1 x 2 x 3 x 4 x 5 x 6 x 7 x 8 4. svc part number : x 1 x 2 x 3 x 4 x 5 x 6 x 7 x 8 company product line wavelength pkg series lens type chip qty ver svc c uv u near 385 n8 aap63 a flat f 1 1 ver0 a y 1 y 2 y 3 y 4
z - power led x10490 z - power led x10490 technical data sheet 13 ?? rev: 00 www.seoulviosys.com www.seoulviosys.com reel packaging 0.8 0.6 0.4 0.2 0.2 0.4 0.6 0.8 eiaj-rrm 16 b 178.5 3 17.5 0.3 19.4 1 2.5 0.2 60.0 + 1.0 cathode mark
z - power led x10490 z - power led x10490 technical data sheet 14 ?? rev: 00 www.seoulviosys.com www.seoulviosys.com recommended solder pad (unit : L ) ? ? recommended pcb solder pad notes : [1] scale : none [2] this drawing without tolerances are for reference only ? : cathode ? : anode
z - power led x10490 z - power led x10490 technical data sheet 15 ?? rev: 00 www.seoulviosys.com www.seoulviosys.com pre-heating 200 180 150 ~ 0 [c] 220 240 260 rising 5 c/sec tm : reflow machine setting temp (max 30 sec.) ts : surface temp of pcb (min) ts : surface temp of pcb (max) ts : surface temp of pcb (recommend) cooling -5 c/sec time [hr] reflow soldering profile * caution 1. reflow soldering should not be done more than one time. 2. repairs should not be done after the leds have been soldered. when repair is unavoidable, suitable tools must be used. 3. die slug is to be soldered. 4. when soldering, do not put stress on the leds during heating. 5. after soldering, do not warp the circuit board. 6. recommend to use a convection type reflow machine with 7 ~ 8 zones.
z - power led x10490 z - power led x10490 technical data sheet 16 ?? rev: 00 www.seoulviosys.com www.seoulviosys.com reliability 1. relative spectral power distribution 2. failure criteria test item standard test method test condition duration /cycle number of damage high temp. operational life internal reference ta=85 , if=500ma 1000hrs 0/5 room temp. operational life internal reference ta=25 , if=500ma 1000hrs 0/5 high temp. storage eiaj ed - 4701 ta = 100 1000hrs 0/22 thermal shock eiaj ed - 4701 ta max=120 , ta min= - 40 30min dwell/transfer time : 10sec, 1 cycle=1hr 200 cycles 0/22 resistance to soldering eiaj ed - 4701 temp=260 5 , time : 10 1 sec 1 time 0/10 esd eiaj ed - 4701 r=1.5k?, c=100pf voltage level=2kv 3 times negative /positive 0/22 parameter symbol test conditions max. or min. allowable shift value forward voltage v f if=500ma max. initial measurement x 1.2 radiant flux e if=500ma min. initial measurement x 0.7 notes : 1. the value is measured after the test sample is cooled down to the room temperature.
z - power led x10490 z - power led x10490 technical data sheet 17 ?? rev: 00 www.seoulviosys.com www.seoulviosys.com 1) storage ? to avoid moisture penetration, we recommend storing uv leds in a dry box with a desiccant. the recommended temperature and relative humidity are between 5 and 30 and below 50% respectively. ? leds must be stored properly to maintain the device. if the leds are stored for 3 months or more after being shipped from svc, a sealed container with a nitrogen atmosphere should be used for storage. ? r eplace the remained leds into the moisture - proof bag and reseal the bag after work to avoid those leds being exposed to moisture. prolonged exposure to moisture can adversely affect the proper functioning of the leds. ? if the package has been opened more than 4 eek(msl_2a) or the color of the desiccant changes, components should be dried for 10 - 12hr at 60 5 ? the conditions of resealing are as follows C temperature is 5 to 40 and relative humidity is less than 30% 2) handling precautions ? vocs (volatile organic compounds) emitted from materials used in the construction of fixtures can penetrate silicone encapsulants of leds and discolor them when exposed to heat and photonic energy. the result can be a significant loss of light output from the fixture. knowledge of the properties of the materials selected to be used in the construction of fixtures can help prevent these issues. ? in case of attaching leds, do not use adhesives that outgas organic vapor. ? soldering should be done as soon as possible after opening the moisture - proof bag. ? do not rapidly cool device after soldering. ? do not apply mechanical force or excess vibration during the cooling process to normal temperature after soldering. ? components sh ould not be mounted on warped (non coplanar) portion of pcb. ? the optical window part of led needs to be handled carefully as below C avoid touching the optical window especially with sharp tools such as pincettes (tweezers) C avoid leaving fingerprints on optical window parts. C optical window will attract dust so use covered containers for storage. C when populating boards in smt production, there are basically no restrictions regarding the form of the pick and place nozzle, except that excessive mechanical pressure on the surface of optical window parts must be prevented. C it is not recommend to cover the optical window of the leds with other resin (epoxy, urethane, etc) precaution for use
z - power led x10490 z - power led x10490 technical data sheet 18 ?? rev: 00 www.seoulviosys.com www.seoulviosys.com 3) safety for eyes and skin ? the products emit high intensity ultraviolet light which can make your eyes and skin harmful, so do not look directly into the uv light and wear protective equipment during operation. 4) cleaning ? this device is not allowed to be used in any type of fluid such as water, oil, organic solvent , etc. 5) others ? the appearance and specifications of the product may be modified for improvement without notice. ? when the leds are in operation the maximum current should be decided after measuring the package temperature. ? the driving circuit must be designed to allow forward voltage only when it is on or off. if the reverse voltage is applied to led, migration can be generated resulting in led damage. ? do not handle this product with acid or sulfur material in sealed space.
z - power led x10490 z - power led x10490 technical data sheet 19 ?? rev: 00 www.seoulviosys.com www.seoulviosys.com revision history rev change date brief summary of change 00 february 15, 2013 preliminary specification 01 august 26, 2013 binning structure update 02 november 20, 2013 data update 03 november 28, 2013 data update(spectrum half width) 04 february 21, 2014 data update

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